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All applications listed here are software products and don’t contain any viruses or malware. You can download the installers freely from the official developer’s web site and the below link as well.This invention relates to a watertight envelope assembly, and more particularly, to a watertight envelope assembly for enclosing a computer-chip video display chip.
A typical computer chip video display may contain one or more individual display chips. Each display chip contains a liquid crystal display which, when electrically energized, displays video images which are then transmitted to a conventional video display. The individual display chips are typically attached to a large circuit board which, in turn, is attached to a computer display. The computer display is typically a CRT display or a light-emitting diode display.
Unfortunately, there is usually at least one gap between the individual display chips and the circuit board. In those instances where the individual display chips contain liquid crystal displays, water can enter the gap. The presence of moisture in the gap can seriously damage the liquid crystal display and shorten its life.
One approach to sealing off the gap between the individual display chips and the circuit board would be to attach a sealant to the outer side of the circuit board. An adhesive such as hot melt glue could be applied to the sides of the circuit board which are then pressed into contact with the display chips. However, the adhesive will flow through the gap and thus not provide a watertight seal.
Another approach would be to utilize an adhesive such as an adhesive material or solder used to attach the display chips to the circuit board. However, using such a solder or adhesive material would entail additional steps such as, for example, melting the solder or hardening the adhesive. Unfortunately, a solder and adhesive material cannot be used effectively with display chips which contain a fragile material such as a liquid crystal display. Although fragile materials are not damaged by adhesive or solder, the materials do not necessarily expand and contract in direct proportion to the heat generated by the application of the adhesive or solder. As such,
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